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2026暑期实习 - 模拟IC设计工程师实习生 / Analog IC Design Engineering Intern

Texas Instruments 🇨🇳 Zhangjialou, Pudong, China

Onsite $60,000 - $80,000 Contract Entry Level

Interns will define, design, model, implement, and document analog, digital, and RF integrated circuits, partnering with business and system engineering teams to develop specifications. Responsibilities also include analyzing chip architecture trade-offs, participating in design reviews, supervising layouts, characterizing prototypes, and driving behavioral models.

Responsibilities

  • Partnering with business teams and system engineering to develop design specifications
  • Providing high-level analysis on chip architecture trade-offs
  • Participating in design reviews and creating design and product documentation
  • Supervising IC layouts to ensure high-performance standards
  • Characterizing prototypes and developing test specifications

Requirements

  • Graduate from Nov 2026 to Oct 2027
  • Strong background in analog IC design engineering

Benefits

  • Competitive pay and benefits
  • Opportunity to work with smart people
  • Diverse and inclusive work environment

Key Skills

Analog IC design engineering Digital IC design RF IC design Integrated circuit design Chip architecture Design specifications Design reviews Product documentation IC layouts Prototyping Test specifications Cross-functional collaboration Communication Problem-solving

About Texas Instruments

We are a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, enterprise systems and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

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