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Principal Package Design Engineering

Renesas Electronics šŸ‡ŗšŸ‡ø Plano, Texas, United States of America

Full-time Principal

Develop, qualify, and optimize package and interconnect technologies for power SiP/modules, flip-chip LGA, multi-chip modules, and power devices, working with subcontractors and internal product, reliability, quality, and operations teams. Establish package design rules and production controls, resolve process and customer issues, support production ramp-up, and contribute to packaging roadmaps.

Responsibilities

  • Develop, qualify, and optimize package and interconnect technologies for power SiP/modules, flip-chip LGA, multi-chip modules, and power devices, working with subcontractors and internal product, reliability, quality, and operations teams. Establish package design rules and production controls, resolve process and customer issues, support production ramp-up, and contribute to packaging roadmaps.

Requirements

  • Requires a bachelor's, master's, or doctoral degree in physics, chemistry, mechanical, electrical, or materials engineering, plus 10–15 years of relevant package-development experience. Candidates should have strong power SiP/module and flip-chip or wafer-level packaging knowledge, assembly and qualification experience, SPC and statistical analysis skills, and strong communication, analytical, and presentation abilities.

Key Skills

Package design engineering Power SiP/module development Flip‑chip LGA technology Multi‑chip module integration Packaging rule definition Production control establishment Statistical Process Control (SPC) Statistical analysis Reliability testing Assembly qualification Mechanical design (CAD) Electrical design (CAD) Materials engineering Thermal analysis Simulation tools (e.g., ANSYS, COMSOL) Design for manufacturability (DFM) Process troubleshooting Customer issue resolution Production ramp‑up support Roadmap contribution Cross‑functional team collaboration Technical communication Presentation skills Project management Problem solving Analytical thinking Documentation standards Quality assurance

About Renesas Electronics

Renesas is an embedded semiconductor solution provider driven by its Purpose ā€œTo Make Our Lives Easier.ā€ As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier

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