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Principal Package Design Engineering

Renesas Electronics 🇺🇸 Plano, Texas, United States of America

Full-time Principal

Develop, qualify, and optimize package and interconnect technologies for power SiP/modules, flip-chip LGA, multi-chip modules, and power devices, working with OSATs, contract manufacturers, product teams, and reliability teams. Establish package design rules and production controls, resolve process and customer issues, support production ramp-up, and contribute to packaging roadmaps and technology development.

Responsibilities

  • Develop, qualify, and optimize package and interconnect technologies for power SiP/modules, flip-chip LGA, multi-chip modules, and power devices, working with OSATs, contract manufacturers, product teams, and reliability teams. Establish package design rules and production controls, resolve process and customer issues, support production ramp-up, and contribute to packaging roadmaps and technology development.

Requirements

  • Requires a bachelor's, master's, or doctoral degree in physics, chemistry, mechanical, electrical, or materials engineering, plus 10–15 years of relevant package-development experience. Candidates should have strong power SiP/module and flip-chip or wafer-level packaging knowledge, assembly and qualification experience, SPC and statistical analysis skills, and strong communication, analytical, and presentation abilities.

Key Skills

Package design System‑in‑Package (SiP) development Flip‑chip and wafer‑level packaging Multi‑chip module (MCM) engineering Power device integration OSAT collaboration Statistical Process Control (SPC) Statistical analysis Mechanical engineering Electrical engineering Materials engineering Reliability testing Design rule creation Production control Problem solving Technical presentation Cross‑functional communication

About Renesas Electronics

Renesas is an embedded semiconductor solution provider driven by its Purpose “To Make Our Lives Easier.” As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier

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