Renesas Electronics logo

Director, Package Design Engineering

Renesas Electronics šŸ‡ŗšŸ‡ø Phoenix, Arizona, United States of America

Full-time Director

Lead package technology development, research and development, new product introduction, and global OSAT/contract manufacturer collaboration for power semiconductor packages, including Smart Power Stages, power modules, and SiC/GaN solutions. Define and execute packaging roadmaps, qualify materials and processes, resolve integration and production issues, establish quality controls, and support customer adoption and complaint resolution.

Responsibilities

  • Lead package technology development, research and development, new product introduction, and global OSAT/contract manufacturer collaboration for power semiconductor packages, including Smart Power Stages, power modules, and SiC/GaN solutions. Define and execute packaging roadmaps, qualify materials and processes, resolve integration and production issues, establish quality controls, and support customer adoption and complaint resolution.

Requirements

  • Requires a bachelor's, master's, or doctoral degree in a relevant engineering or science field and 15–20 years of relevant package development experience. Candidates should have strong expertise in power SiP/modules, wafer-level and flip-chip packaging, assembly processes, qualification, SPC, and statistical analysis; wire bonding and multi-chip module knowledge are advantageous.

Key Skills

Package technology development Power semiconductor packaging Smart Power Stages Power modules SiC/GaN solutions R&D leadership New product introduction Global OSAT collaboration Packaging roadmaps Material qualification Process qualification Integration issue resolution Production issue resolution Quality control establishment Customer adoption support Complaint resolution Statistical process control (SPC) Statistical analysis Wire bonding knowledge Multi‑chip module expertise Cross‑functional collaboration Technical communication

About Renesas Electronics

Renesas is an embedded semiconductor solution provider driven by its Purpose ā€œTo Make Our Lives Easier.ā€ As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier

BEFORE YOU APPLY

Make sure your resume makes it through AI screening

Upload your resume

Never miss similar opportunities šŸ””

Get notified when new design engineering jobs that match your preferences become available. Set up personalized job alerts to stay ahead of the competition.