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Director, Package Design Engineering

Renesas Electronics šŸ‡ŗšŸ‡ø Dallas, Texas, United States of America

Full-time Director

Lead package technology development, research and development, new product introduction, qualification, and global OSAT/contract manufacturer activities for power packaging, including smart and vertical power stages, power modules, and discrete FET packages. Define technology roadmaps and design rules, optimize and control assembly processes, support production ramp-up and quality, and address customer issues in collaboration with internal teams.

Responsibilities

  • Lead package technology development, research and development, new product introduction, qualification, and global OSAT/contract manufacturer activities for power packaging, including smart and vertical power stages, power modules, and discrete FET packages. Define technology roadmaps and design rules, optimize and control assembly processes, support production ramp-up and quality, and address customer issues in collaboration with internal teams.

Requirements

  • Requires a bachelor's, master's, or doctoral degree in physics, chemistry, mechanical, electrical, or materials engineering, plus 15–20 years of relevant package development experience. Candidates should have strong expertise in power SiP/module and wafer-level or flip-chip packaging, assembly and qualification methods, SPC, and statistical analysis; wire bonding and multi-chip module knowledge is a plus.

Key Skills

Package technology development Power semiconductor packaging Smart Power Stages Vertical Power Stages Power modules Discrete FET packages R&D execution New product introduction Qualification activities Global OSAT collaboration Technology roadmaps Design rule development Assembly process optimization Production ramp support Quality control Customer issue management Statistical process control (SPC) Statistical analysis Wire bonding knowledge Multi‑chip module expertise Cross‑functional teamwork Technical communication

About Renesas Electronics

Renesas is an embedded semiconductor solution provider driven by its Purpose ā€œTo Make Our Lives Easier.ā€ As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier

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