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Director, Package Design Engineering

Renesas Electronics šŸ‡ŗšŸ‡ø Austin, Texas, United States of America

Full-time Director

Lead package technology development, research and development, and new product introduction for power semiconductor packages, including Smart Power Stages, Vertical Power Stages, power modules, and discrete FET packages. Manage global assembly partners, qualification, process optimization and production ramp-up, while defining technology roadmaps and design rules and resolving quality and customer issues.

Responsibilities

  • Lead package technology development, research and development, and new product introduction for power semiconductor packages, including Smart Power Stages, Vertical Power Stages, power modules, and discrete FET packages. Manage global assembly partners, qualification, process optimization and production ramp-up, while defining technology roadmaps and design rules and resolving quality and customer issues.

Requirements

  • Requires a bachelor's, master's, or doctoral degree in physics, chemistry, mechanical, electrical, or materials engineering, plus 15–20 years of relevant package development experience. Candidates should have strong expertise in power SiP/modules, wafer-level and flip-chip packaging, assembly processes, qualification, SPC, and statistical analysis; wire bonding and multi-chip module knowledge are advantageous.

Key Skills

Package technology development Power semiconductor packaging Smart Power Stages Vertical Power Stages Power modules Discrete FET packages R&D leadership New product introduction Global assembly partner management Qualification processes Process optimization Production ramp‑up Technology roadmaps Design rule definition Quality issue resolution Statistical process control (SPC) Statistical analysis Wire bonding knowledge Multi‑chip module expertise Cross‑functional collaboration Technical communication

About Renesas Electronics

Renesas is an embedded semiconductor solution provider driven by its Purpose ā€œTo Make Our Lives Easier.ā€ As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier

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