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Director, Package Design Engineering

Renesas Electronics šŸ‡ŗšŸ‡ø San Jose, California, United States of America

$230,000 - $260,000 Full-time Director

Lead package technology development, R&D, new product introduction, and global OSAT/contract manufacturer collaboration for power semiconductor packages, including Smart Power Stages, power modules, and SiC/GaN solutions. Define and execute packaging roadmaps, qualify materials and processes, ensure production quality and ramp readiness, resolve process and customer issues, and manage R&D budgets and customer adoption programs.

Responsibilities

  • Lead package technology development, R&D, new product introduction, and global OSAT/contract manufacturer collaboration for power semiconductor packages, including Smart Power Stages, power modules, and SiC/GaN solutions. Define and execute packaging roadmaps, qualify materials and processes, ensure production quality and ramp readiness, resolve process and customer issues, and manage R&D budgets and customer adoption programs.

Requirements

  • Requires a bachelor's, master's, or doctoral degree in physics, chemistry, mechanical, electrical, or materials engineering, plus 15–20 years of relevant package development experience. Candidates should have strong expertise in power SiP/modules, wafer-level and flip-chip packaging, assembly and qualification methods, SPC, and statistical analysis; wire bonding and multi-chip module knowledge are advantageous.

Key Skills

Package technology development Power semiconductor packaging Smart Power Stages SiC/GaN solutions R&D management New product introduction OSAT/contract manufacturer collaboration Packaging roadmaps Material qualification Process qualification Production quality assurance Ramp readiness Issue resolution R&D budget management Customer adoption programs Statistical process control (SPC) Statistical analysis Wire bonding knowledge Multi‑chip module expertise Cross‑functional leadership Technical communication

About Renesas Electronics

Renesas is an embedded semiconductor solution provider driven by its Purpose ā€œTo Make Our Lives Easier.ā€ As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier

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