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Director, Package Design Engineering
Renesas Electronics đşđ¸ Phoenix, Arizona, United States of America
The Director will lead package technology development, NPI, and global OSAT management for AI and datacenter infrastructure power packaging. They are responsible for defining technology roadmaps, managing R&D budgets, and ensuring high-quality production transitions.
Responsibilities
- The Director will lead package technology development, NPI, and global OSAT management for AI and datacenter infrastructure power packaging. They are responsible for defining technology roadmaps, managing R&D budgets, and ensuring high-quality production transitions.
Requirements
- Candidates must hold a degree in Physics, Chemistry, or Engineering with 15 to 20 years of relevant experience in power SiP, module, and flip-chip packaging. Strong expertise in assembly processes, qualification methods, and statistical analysis is required.
Key Skills
About Renesas Electronics
Renesas is an embedded semiconductor solution provider driven by its Purpose âTo Make Our Lives Easier.â As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier
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