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Director, Package Design Engineering
Renesas Electronics 🇺🇸 San Jose, California, United States of America
The Director will lead package technology development, NPI, and global OSAT management for AI and datacenter power packaging needs. They are responsible for defining technology roadmaps, managing R&D budgets, and ensuring the successful qualification and production ramp-up of new packaging processes.
Responsibilities
- The Director will lead package technology development, NPI, and global OSAT management for AI and datacenter power packaging needs. They are responsible for defining technology roadmaps, managing R&D budgets, and ensuring the successful qualification and production ramp-up of new packaging processes.
Requirements
- Candidates must possess a Doctorate, Master's, or Bachelor's degree in a relevant engineering or science field with 15 to 20 years of experience in power SiP and advanced packaging. Strong expertise in assembly processes, statistical analysis, and cross-functional communication is required to manage internal and external stakeholder relationships.
Benefits
- Bonus opportunities
Key Skills
About Renesas Electronics
Renesas is an embedded semiconductor solution provider driven by its Purpose “To Make Our Lives Easier.” As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier
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