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FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months)
Qualcomm đ¨đŚ Toronto, Ontario, Canada
The intern will work on the end-to-end design of high-speed interconnect features and optimizations using hardware design languages. They will also collaborate cross-functionally to assess design requirements, analyze test failures, and improve design workflows.
Responsibilities
- The intern will work on the end-to-end design of high-speed interconnect features and optimizations using hardware design languages. They will also collaborate cross-functionally to assess design requirements, analyze test failures, and improve design workflows.
Requirements
- Candidates must be enrolled in a bachelor's degree program in Electrical Engineering, Computer Engineering, or a related field with an expected graduation date of November 2028 or later. Applicants should have academic experience with programming languages like C, C++, or Python and a foundational understanding of digital logic and ASIC design.
Benefits
- Competitive hourly pay
- Accrued vacation time
- Housing stipend
- Professional development workshops
- Social events
- Executive speaker series
Key Skills
About Qualcomm
Inspired by 250 years of American ingenuity, we build technologies that expand whatâs possible. From wireless to AI at scale and 6G, our innovations power progress worldwide.
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