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Senior Director, Package Design Engineering
Renesas Electronics đşđ¸ Austin, Texas, United States of America
Lead a global technical program management organization to drive the execution of strategic AI and datacenter infrastructure power package engineering programs. Establish program governance, manage cross-functional task forces, and ensure production readiness while maintaining quality and reliability standards.
Responsibilities
- Lead a global technical program management organization to drive the execution of strategic AI and datacenter infrastructure power package engineering programs. Establish program governance, manage cross-functional task forces, and ensure production readiness while maintaining quality and reliability standards.
Requirements
- Requires a Doctorate, Masterâs, or Bachelorâs degree in a technical field and 15-20+ years of relevant experience in semiconductor engineering or program management. Candidates must demonstrate expertise in package development, OSAT management, and leading complex NPI programs in a high-growth environment.
Key Skills
About Renesas Electronics
Renesas is an embedded semiconductor solution provider driven by its Purpose âTo Make Our Lives Easier.â As a leader in embedded processing, analog, mixed-signal and power solutions, we combine our expertise in hardware, software and cloud-native development to enable our Secular Growth Vectors - AI Infra & Compute, Physical AI/Software-Defined Vehicle (SDV), Industrial, and Intelligence at the Edge. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through intelligent, cloud-based digital platforms like Renesas 365, ushering in a new era of innovation. We design and develop sustainable, power-efficient solutions and intelligent digital platforms that help people and communities thrive. #To Make Our Lives Easier
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