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Director, Package Design Engineering
Renesas Electronics 🇺🇸 San Jose, California, United States of America
The Director of Package Design Engineering will lead package technology development, R&D, and global OSAT management for AI and datacenter power packaging. This role involves defining technology roadmaps, managing R&D budgets, and ensuring the qualification and production ramp-up of advanced power packaging solutions.
Responsibilities
- The Director of Package Design Engineering will lead package technology development, R&D, and global OSAT management for AI and datacenter power packaging. This role involves defining technology roadmaps, managing R&D budgets, and ensuring the qualification and production ramp-up of advanced power packaging solutions.
Requirements
- Candidates must possess a Bachelor's, Master's, or Doctorate degree in a relevant engineering or science field. A minimum of 15 to 20 years of experience in power SiP, module, wafer level, and flip-chip packaging is required.
Benefits
- Bonus opportunities
- Competitive benefits package
Key Skills
About Renesas Electronics
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
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