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Copy of Director, Package Design Engineering
Renesas Electronics 🇺🇸 Phoenix, Arizona, United States of America
The Director will lead package technology development, NPI, and global OSAT management for power packaging solutions including SiC and GaN technologies. They are responsible for defining technology roadmaps, managing R&D budgets, and ensuring high-quality production transitions.
Responsibilities
- The Director will lead package technology development, NPI, and global OSAT management for power packaging solutions including SiC and GaN technologies. They are responsible for defining technology roadmaps, managing R&D budgets, and ensuring high-quality production transitions.
Requirements
- Candidates must hold a degree in Physics, Chemistry, or Engineering and possess 15 to 20 years of relevant experience in power SiP, module, and wafer-level packaging. Strong analytical skills and deep knowledge of assembly processes and qualification methods are required.
Key Skills
About Renesas Electronics
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
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