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Package Design Engineering - Director
Renesas Electronics 🇲🇾 Shah Alam, Petaling, Malaysia
The Director will lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role involves driving yield performance, process stability, and cross-functional collaboration to ensure successful NPI-to-HVM transitions.
Responsibilities
- The Director will lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role involves driving yield performance, process stability, and cross-functional collaboration to ensure successful NPI-to-HVM transitions.
Requirements
- Candidates must possess a bachelor's degree in a relevant engineering field and over 12 years of experience in semiconductor manufacturing and packaging. Strong expertise in IC assembly processes, OSAT management, and leadership in high-volume production environments is required.
Key Skills
About Renesas Electronics
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
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