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ASIC Package Design Manager
Broadcom 🇺🇸 Fort Collins, Colorado, United States of America
Lead a team of engineers in designing complex flip-chip-BGA packages for high-performance ASICs used in AI, networking, and 5G. Manage project plans for over 20 concurrent designs while developing technical methodologies and collaborating with cross-functional teams.
Responsibilities
- Lead a team of engineers in designing complex flip-chip-BGA packages for high-performance ASICs used in AI, networking, and 5G. Manage project plans for over 20 concurrent designs while developing technical methodologies and collaborating with cross-functional teams.
Requirements
- Requires a BSEE/MSEE with over 12 years of experience in flip-chip-BGA package design and at least 3 years in a management role. Must possess deep technical knowledge of SI/PI, package-design lifecycles, and DFx trade-offs.
Benefits
- Medical insurance
- Dental insurance
- Vision insurance
- 401(K) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave
- Vacation time
- Discretionary annual bonus
- Equity grants
Key Skills
About Broadcom
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
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