Principal, Design Engineering (Thermal)

Lead the complete thermal design process for electronic products, from modeling and simulation to testing and manufacturing transfer. Develop high-end cooling solutions for AI servers and accelerators using both air and liquid cooling technologies.

Responsibilities

• Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing
• Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs
• Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products
• Conceive and implement ways to enhance and extend operation of heat transfer hardware
• Consider the thermal aspects of chip packaging technologies
• Apply best-in-class fluid flow geometry and technology to cool high heat flux chips

Requirements

• 15+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for high-performance computing or data
• Hands-on experience with manufacturing processes, supplier management, and technology transfer
• Strong understanding of liquid cooling–specific reliability, safety, and performance challenges
• Bachelor's degree in Mechanical Engineering

Benefits

• Medical Insurance (Health, Dental & Vision)
• Paid Time Off
• 401K

Key Skills