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Sr Engineer - Die Design Engineering APTD
Micron Technology 🇮🇳 Hyderabad, Bahadurpura mandal, India
The role involves defining TSV placement strategy, overseeing micro-bump array design, and ensuring die design supports reliable thermo-compression bonding processes. The engineer will also serve as the primary technical interface between the die design team and various cross-functional engineering groups.
Responsibilities
- Define TSV placement strategy considering keep-out zones, stress-aware layout, CMP density, and wafer thinning constraints
- Oversee micro-bump array design, landing pad rules, and RDL routing in coordination with packaging engineering
- Collaborate with process integration teams on TSV reveal, backside RDL, and hybrid bonding design requirements as technology evolves
- Serve as the primary technical interface between die design team and packaging, process integration, test, reliability, and product engineering teams
Requirements
- Master's or PhD degree in Electrical Engineering, Computer Engineering, or related field
- 5+ years of experience in die design and physical layout engineering
- Direct hands-on experience with HBM, 3D-IC, or advanced packaging programs
- Proven experience with TSV-based die design including KOZ management, micro-bump layout, and backside RDL
Benefits
- Opportunity to work with a world leader in innovating memory and storage solutions
- Collaborative and dynamic work environment
- Professional development and growth opportunities
Key Skills
About Micron Technology
Micron is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.
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